How DreamBig Achieved Industry-First 3D HBM Integration with Synopsys
We're thrilled to share the results of our partnership with Synopsys, recently featured as a case study, showcasing how our Chiplet Hub™ platform is revolutionizing AI infrastructure with industry-leading performance and efficiency.
Breaking New Ground in Chiplet Design
Our collaboration with Synopsys has yielded tangible results, with their leading EDA solutions enabling us to accelerate our progress to our goal: an industry-first 3D HBM on logic die integration while meeting all performance targets and staying within challenging power budgets. This breakthrough addresses the most difficult challenges in scaling silicon infrastructure for AI applications.
Accelerated Time-to-Market
Using Synopsys 3DIC Compiler, we achieved our complex 3D integration architecture 6 months faster than traditional methods would have allowed. This early physical architecture exploration was crucial in converging on the most efficient design while balancing power, performance, and area constraints.
Boosting Engineering Productivity
Through Synopsys Cloud FlexEDA licensing, our engineering team boosted their productivity substantially. The automated license management eliminated the need to manage fixed license sets, allowing our team to focus on design innovation rather than infrastructure management.
The Future of AI Infrastructure
With Synopsys' comprehensive verification solutions, we were certain of first-tapeout success, even using first-of-their kind techniques to partition the solution in a chiplet-based architecture. This positions our open chiplet platform as the foundation for next-generation AI, data center, edge compute, and automotive applications.